/Substrate Processing Apparatus, Temperature Control Device, And Temperature Control Method
Abstract

A plasma processing system has a supply, a main body section, and controller circuitry. The supply supplying each of a plurality of heat media, the plurality of heat media having a different temperature. The main body section has, formed therein, a plurality of flow paths that respectively allow the plurality of heat media to separately flow therethrough, and is included in the plasma processing system. The controller circuitry performs control, when a first heat medium of the plurality of heat media is caused to flow through the plurality of flow paths from the supply, to cause a second heat medium of the plurality of heat media and other than the first heat medium to be discharged from the plurality of flow paths.

Full Text

What is claimed is:

A plasma processing system has a supply, a main body section, and controller circuitry. The supply supplying each of a plurality of heat media, the plurality of heat media having a different temperature. The main body section has, formed therein, a plurality of flow paths that respectively allow the plurality of heat media to separately flow therethrough, and is included in the plasma processing system. The controller circuitry performs control, when a first heat medium of the plurality of heat media is caused to flow through the plurality of flow paths from the supply, to cause a second heat medium of the plurality of heat media and other than the first heat medium to be discharged from the plurality of flow paths.
Timeline
Filed
04/14/2026
Published
08/20/2026
Granted
Not Available
IPC Codes(1)
H01J 37/32:Gas-filled discharge tubes (heating by discharge H05B)