The present disclosure generally relates to a capacitor on an integrated circuit (IC) die. In an example, a conductive bottom plate is disposed over a semiconductor substrate. A conductive top plate is disposed over and spaced apart from the bottom plate by a first distance from a top surface of the bottom plate to a bottom surface of the top plate, the first distance being at least 15 μm. A polymer layer is disposed over the top plate, a second distance being from a top surface of the top plate to a bottom surface of the polymer layer, the second distance being at least 30% of the first distance.