Abstract
Various embodiments of the present disclosure are directed towards an integrated chip. A substrate comprises a plurality of protrusions on a first surface of the substrate. A plurality of photosensitive regions are in the substrate under the plurality of protrusions. A first plurality of lens structures are on the first surface of the substrate. A first lens structure of the first plurality of lens structures is laterally between a pair of adjacent protrusions of the plurality of protrusions. A height of the first lens structure is greater than a height of the plurality of protrusions.
Full Text
What is claimed is:
Various embodiments of the present disclosure are directed towards an integrated chip. A substrate comprises a plurality of protrusions on a first surface of the substrate. A plurality of photosensitive regions are in the substrate under the plurality of protrusions. A first plurality of lens structures are on the first surface of the substrate. A first lens structure of the first plurality of lens structures is laterally between a pair of adjacent protrusions of the plurality of protrusions. A height of the first lens structure is greater than a height of the plurality of protrusions.
Timeline
Filed
04/15/2026Published
08/20/2026Granted
Not AvailableIPC Codes(1)
H10F 39/00:Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group e.g. radiation detectors comprising photodiode arrays