A marked receptacle and method for marking the receptacle while it is moved along a conveying path wherein the method includes: moving the receptacle in a marking station along the conveying path; simultaneously marking a first surface region and a second surface region of the receptacle while it is moved in the marking station along the conveying path, and using a first laser beam and a second laser beam emitted in opposite directions on sides of the receptacle transversally to the conveying direction; wherein the first and second surface regions are arranged at about 180° from each other with respect to a main axis of the receptacle.