Abstract
A laminate excellent in adhesion between a substrate containing copper and a perfluoropolymer coating film is provided. A method of forming such a laminate excellent in adhesion is also provided. The laminate includes a substrate containing copper and a coating film containing perfluoropolymer, having an adhesion strength between the substrate and the coating film of 0.2 N/mm or more, and a surface roughness of the coating film of less than 15 μm.
Full Text
What is claimed is:
A laminate excellent in adhesion between a substrate containing copper and a perfluoropolymer coating film is provided. A method of forming such a laminate excellent in adhesion is also provided. The laminate includes a substrate containing copper and a coating film containing perfluoropolymer, having an adhesion strength between the substrate and the coating film of 0.2 N/mm or more, and a surface roughness of the coating film of less than 15 μm.
Timeline
Filed
04/14/2026Published
08/20/2026Granted
Not AvailableIPC Codes(2)
B05D 1/00:Processes for applying liquids or other fluent materials (, take precedence B05D 5/00, B05D 7/00)
B05D 3/02:by baking