Abstract
A substrate processing apparatus capable of improving the uniformity of thin films on a substrate includes: a substrate support unit having a first slope; and a flow control ring arranged to surround the substrate support unit and having a second slope, wherein, during alignment, as the substrate support unit moves in a first direction, the first slope and the second slope contact each other, and due to the contact, the flow control ring slides in a second direction that is different from the first direction.
Full Text
What is claimed is:
A substrate processing apparatus capable of improving the uniformity of thin films on a substrate includes: a substrate support unit having a first slope; and a flow control ring arranged to surround the substrate support unit and having a second slope, wherein, during alignment, as the substrate support unit moves in a first direction, the first slope and the second slope contact each other, and due to the contact, the flow control ring slides in a second direction that is different from the first direction.
Timeline
Filed
04/20/2026Published
08/27/2026Granted
Not AvailableIPC Codes(3)
H10P 72/00:Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
H10P 72/50:for positioning, orientation or alignment
H10P 72/76:using mechanical means, e.g. clamps or pinches