An exposure apparatus includes a spatial light modulator, a calculation unit configured to calculate positions of first connection portions of a first semiconductor chip provided on a substrate and positions of second connection portions of a second semiconductor chip provided on the substrate, based on a first position measurement result, a second position measurement result, and design information of the first connection portions and the second connection portions, the first position measurement result being a measurement result of positions of measurement points on the first semiconductor chip, the second position measurement result being a measurement result of positions of measurement points on the second semiconductor chip, and an exposure processing unit configured to control the spatial light modulator based on a calculation result by the calculation unit so as to expose wiring patterns connecting the first connection portions and the second connection portions.