/Electronic Device Comprising Structures For Dispersing Heat
Abstract

An electronic device is provided. The electronic device includes a display, an electronic component, and a heat spreading member disposed to at least partially overlap the electronic component when viewed from above the display, wherein the heat spreading member includes a first plate facing the electronic component, a second plate facing the first plate, a separating structure disposed in an internal space between the first plate and the second plate such that a first flow path and a second flow path are respectively formed along a first lateral surface and a second lateral surface opposite to the first lateral surface, and a wick structure for moving a fluid along at least one of the first flow path or the second flow path, wherein the wick structure includes a first wick portion located in the first flow path and the second flow path, and a second wick portion located over a portion of the first wick portion corresponding to the second flow path.

Full Text

What is claimed is:

An electronic device is provided. The electronic device includes a display, an electronic component, and a heat spreading member disposed to at least partially overlap the electronic component when viewed from above the display, wherein the heat spreading member includes a first plate facing the electronic component, a second plate facing the first plate, a separating structure disposed in an internal space between the first plate and the second plate such that a first flow path and a second flow path are respectively formed along a first lateral surface and a second lateral surface opposite to the first lateral surface, and a wick structure for moving a fluid along at least one of the first flow path or the second flow path, wherein the wick structure includes a first wick portion located in the first flow path and the second flow path, and a second wick portion located over a portion of the first wick portion corresponding to the second flow path.
Timeline
Filed
04/22/2026
Published
08/27/2026
Granted
Not Available
IPC Codes(2)
H05K 7/20:Modifications to facilitate cooling, ventilating, or heating
H05K 5/02:Details