Abstract
A power module and a power device are provided. The power module includes: a circuit board including an upper surface layer and a lower surface layer; at least one switch circuit arranged on the upper surface layer of the circuit board, the switch circuit including a first switch unit, a second switch unit, and a first capacitor unit, and the first switch unit, the second switch unit, and the first capacitor unit are electrically connected to form a commutation loop which is located on the upper surface layer or passes through the upper surface layer; and a metal plate arranged above the first switch unit, the second switch unit, and the first capacitor unit.
Full Text
What is claimed is:
A power module and a power device are provided. The power module includes: a circuit board including an upper surface layer and a lower surface layer; at least one switch circuit arranged on the upper surface layer of the circuit board, the switch circuit including a first switch unit, a second switch unit, and a first capacitor unit, and the first switch unit, the second switch unit, and the first capacitor unit are electrically connected to form a commutation loop which is located on the upper surface layer or passes through the upper surface layer; and a metal plate arranged above the first switch unit, the second switch unit, and the first capacitor unit.
Timeline
Filed
04/21/2026Published
08/27/2026Granted
Not AvailableIPC Codes(5)
H02M 1/44:Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
H02M 3/00:Conversion of DC power input into DC power output
H02M 7/00:Conversion of AC power input into DC power output; Conversion of DC power input into AC power output