A method of operating a substrate processing system includes: storing, for temperature control elements of a substrate support, temperature and sensitivity calibration values, where the substrate is configured to support a substrate; during calibration of the plurality of temperature control elements, perform a first calibration process to determine the temperature calibration values or a second calibration process to determine the sensitivity calibration values, where the sensitivity calibration values relate trim amounts to temperature changes or deposition amounts to temperature changes; determining operating parameters for the temperature control elements based on the temperature calibration values and the sensitivity calibration values; and subsequent to the calibration of the temperature control elements, controlling operation of the temperature control elements during at least one of a trim step or a deposition step based on the operating parameters.