An array level packaged uncooled infrared detector includes a read-out circuit substrate and active elements arranged on the upper surface of the read-out circuit substrate and electrically connected with the read-out circuit substrate. The array level packaged uncooled infrared detector also includes a getter deposition area. The array level packaged uncooled infrared detector opens up a separate area for the getter body, and deposits the getter body after the release of the structural sacrifice layer, avoiding the impact of high temperature and organic solution in the process of mems technology on the performance of the getter body, and adopts thermal activation. The activation mode of the getter body is simple, and it is easy to carry out batch production and manufacturing.