Abstract
A module includes a predetermined number of stacked memories. The predetermined number of stacked memories each includes memory chips stacked by bump-less connection, a packaging part that packages the predetermined number of stacked memories, and an external wiring disposed on one surface of the stacked memories in a stacking direction.
Full Text
What is claimed is:
A module includes a predetermined number of stacked memories. The predetermined number of stacked memories each includes memory chips stacked by bump-less connection, a packaging part that packages the predetermined number of stacked memories, and an external wiring disposed on one surface of the stacked memories in a stacking direction.
Timeline
Filed
04/21/2026Published
08/27/2026Granted
Not AvailableIPC Codes(10)
H10B 80/00:Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10B 99/00:Subject matter not provided for in other groups of this subclass
H10P 54/00:Cutting or separating of wafers, substrates or parts of devices