A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a device region and a seal ring region surrounding the device region. The semiconductor device structure includes a seal ring structure over the seal ring region. The semiconductor device structure includes a pad over and connected to the seal ring structure. The semiconductor device structure includes a passivation layer covering the pad. The semiconductor device structure includes a conductive plug passing through the passivation layer and connected to the pad. The semiconductor device structure includes a first bonding pad over and connected to the conductive plug. The first bonding pad at least partially overlaps the seal ring structure and the pad along an axis perpendicular to a top surface of the substrate.