Abstract
Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.
Full Text
What is claimed is:
Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a peripheral region of a substrate. Methods, systems, and assemblies can be used to obtain desired (e.g. composition and/or thickness) profiles of material on a substrate surface.
Timeline
Filed
04/27/2026Published
09/03/2026Granted
Not AvailableIPC Codes(4)
H10P 72/76:using mechanical means, e.g. clamps or pinches
C23C 16/458:characterised by the method used for supporting substrates in the reaction chamber
H10P 14/24:using chemical vapour deposition [CVD]