A light emitting device includes a base member, one or more semiconductor laser elements, a lid member, and a bonding member. The base member includes a first upper surface and a second upper surface located above the first upper surface. The lid member includes a lower surface bonded to the second upper surface. The bonding member has a thickness of at least 15 μm and less than 40 μm between the base member and the lid member. The bonding member is a solder that has been solidified in a state of bonding the base member and the lid member. The bonding member includes a region disposed on the second upper surface, the region protruding outward beyond an outer edge of the lid member in top view. A space in which the one or more semiconductor laser elements are disposed is sealed.