/High Precision Photonic Alignment Device
Abstract

Various embodiments provide alignment devices and methods of manufacturing and methods of using alignment devices. In an example embodiment, an alignment device includes a first substrate comprising inputs at respective input positions, outputs at respective output positions, and waveguides configured to provide optical paths from respective inputs to respective outputs. The respective input positions are fabricated in accordance with an input position array determined based on measured positions of optical fiber cores of optical fibers secured to a coupling element array. The coupling element array comprises a plurality of coupling elements having a respective one of the optical fibers secured therein. Each optical fiber is associated with a respective input and the input position array indicates the position of each respective input. The respective output positions are configured to provide respective optical signals to the respective target locations of the receiving device.

Full Text

What is claimed is:

Various embodiments provide alignment devices and methods of manufacturing and methods of using alignment devices. In an example embodiment, an alignment device includes a first substrate comprising inputs at respective input positions, outputs at respective output positions, and waveguides configured to provide optical paths from respective inputs to respective outputs. The respective input positions are fabricated in accordance with an input position array determined based on measured positions of optical fiber cores of optical fibers secured to a coupling element array. The coupling element array comprises a plurality of coupling elements having a respective one of the optical fibers secured therein. Each optical fiber is associated with a respective input and the input position array indicates the position of each respective input. The respective output positions are configured to provide respective optical signals to the respective target locations of the receiving device.
Timeline
Filed
05/08/2026
Published
09/03/2026
Granted
Not Available
IPC Codes(2)
G01B 11/27:for testing the alignment of axes
G03F 7/00:Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P 76/00, H05K)