Abstract
An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.
Full Text
What is claimed is:
An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.
Timeline
Filed
04/27/2026Published
09/03/2026Granted
Not AvailableIPC Codes(7)
H10W 42/20:protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
H10W 70/05:of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W 70/04)
H10W 70/685:comprising multiple insulating layers