/Control Parameter Setting Method, Substrate Processing Apparatus, And Storage Medium
Abstract

A control parameter setting method for setting control parameters of film forming modules included, includes: acquiring a first parameter group including control parameters for controlling a film forming process in a first film forming module, and a second parameter group including control parameters for controlling a film forming process in a second film forming module; acquiring a film thickness value of a processed film on a substrate subjected to film formation by the first film forming module based on the first parameter group, and a film thickness value of a processed film on a substrate subjected to film formation by the second film forming module based on the second parameter group; and updating the first parameter group and the second parameter group so that a difference between the film thickness values acquired in the first film forming module and the second film forming module is reduced.

Full Text

What is claimed is:

A control parameter setting method for setting control parameters of film forming modules included, includes: acquiring a first parameter group including control parameters for controlling a film forming process in a first film forming module, and a second parameter group including control parameters for controlling a film forming process in a second film forming module; acquiring a film thickness value of a processed film on a substrate subjected to film formation by the first film forming module based on the first parameter group, and a film thickness value of a processed film on a substrate subjected to film formation by the second film forming module based on the second parameter group; and updating the first parameter group and the second parameter group so that a difference between the film thickness values acquired in the first film forming module and the second film forming module is reduced.
Timeline
Filed
05/04/2026
Published
09/10/2026
Granted
Not Available
IPC Codes(2)
B05D 1/00:Processes for applying liquids or other fluent materials (, take precedence B05D 5/00, B05D 7/00)
B05C 5/02:from an outlet device in contact, or almost in contact, with the work (takes precedence B05C 5/04)