Abstract
Methods and systems for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses. The recesses are at least partially filled with a gap filling fluid. The gap filling fluid comprises a Si—H bond.
Full Text
What is claimed is:
Methods and systems for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses. The recesses are at least partially filled with a gap filling fluid. The gap filling fluid comprises a Si—H bond.
Timeline
Filed
05/04/2026Published
09/10/2026Granted
Not AvailableIPC Codes(5)
H10P 14/60:of insulating materials
B05D 1/00:Processes for applying liquids or other fluent materials (, take precedence B05D 5/00, B05D 7/00)
B05D 1/38:with intermediate treatment