/Capacitance Reduction For Back-side Power Rail Device
Abstract

A semiconductor transistor device including a channel structure, gate structure, a first source/drain structure, a second source/drain structure, and a back-side source/drain contact. The gate structure overlies the channel structure. The first source/drain structure and the second source/drain structure are disposed on opposite endings of the channel structure. The back-side source/drain contact is disposed under the first source/drain structure. A line lies across the gate structure and the first source/drain structure. The line is parallel to an upper surface of the gate structure.

Full Text

What is claimed is:

A semiconductor transistor device including a channel structure, gate structure, a first source/drain structure, a second source/drain structure, and a back-side source/drain contact. The gate structure overlies the channel structure. The first source/drain structure and the second source/drain structure are disposed on opposite endings of the channel structure. The back-side source/drain contact is disposed under the first source/drain structure. A line lies across the gate structure and the first source/drain structure. The line is parallel to an upper surface of the gate structure.
Timeline
Filed
05/11/2026
Published
09/10/2026
Granted
Not Available
IPC Codes(4)
H10D 30/67:Thin-film transistors [TFT]
H10D 30/01:Manufacture or treatment
H10D 62/10:Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies