A cover plate separation member separation member for an electronic device including a frame, a cover plate, and an adhesive member for bonding the frame and the cover plate is provided. The cover plate separation member includes a high thermal conductivity area which is a relatively high thermal conductivity and positioned to at least partially overlap the adhesive member when the cover plate separation member is positioned on the cover plate, and a low thermal conductivity area which has a relatively low thermal conductivity compared to the high thermal conductivity area and positioned to at least partially overlap an area of the electronic device where the adhesive member is not positioned when the cover plate separation member is positioned on the cover plate.