Abstract
Embodiments disclosed herein include cores for package substrates. In an embodiment, the core comprises a first substrate, where the first substrate comprises glass. In an embodiment, the core further comprises a first through glass via (TGV) through the first substrate and a second substrate, where the second substrate comprises glass. In an embodiment, the core further comprises a second TGV through the second substrate, where the first TGV is aligned with the second TGV.
Full Text
What is claimed is:
Embodiments disclosed herein include cores for package substrates. In an embodiment, the core comprises a first substrate, where the first substrate comprises glass. In an embodiment, the core further comprises a first through glass via (TGV) through the first substrate and a second substrate, where the second substrate comprises glass. In an embodiment, the core further comprises a second TGV through the second substrate, where the first TGV is aligned with the second TGV.
Timeline
Filed
05/04/2026Published
09/10/2026Granted
Not AvailableIPC Codes(6)
H10W 70/63:Vias, e.g. via plugs
H10W 46/00:Marks applied to devices, e.g. for alignment or identification
H10W 70/65:Shapes or dispositions of interconnections