There is provided a semiconductor device including a chip that has a main surface, a semiconductor region of a first conductivity type that is formed in a surface layer portion of the main surface, an active region that is provided in an inner portion of the main surface, an outer peripheral region that is provided in a peripheral edge portion of the main surface, a separating structure of a trench type that is formed in the main surface so as to be positioned in the semiconductor region and demarcates the active region and the outer peripheral region, and a well region of a second conductivity type that is formed in a region below the separating structure so as to be positioned in the semiconductor region and is electrically connected to the semiconductor region.