A method is presented for altering a portion of a substrate. The method includes providing a first device including an outer surface and a second device including a source of vibration energy. The method also includes forming a nip between the source of vibration energy and the outer surface. The method also includes conveying the substrate through the nip and intermittently altering the portion of the substrate in the nip to create a pattern of altered areas forming a shape. The altered areas have a pattern balance that includes one or more of: an average area of the substrate altered in the nip is within a threshold range across the portion of the substrate; and a simple area of integral areas within the altered areas is within a threshold range across the portion of the substrate.