/Semiconductor Device And Method Of Forming The Same
Abstract

A semiconductor device includes a semiconductor structure extending lengthwise along a first direction, with a first source/drain feature and a second source/drain feature disposed on the semiconductor structure and spaced apart from each other. A gate structure extends lengthwise along a second direction across the semiconductor structure and is positioned between the first source/drain feature and the second source/drain feature. A source/drain contact is disposed over the first source/drain feature. A dielectric layer extends along a sidewall of the source/drain contact and protrudes over a top surface of the source/drain contact. Furthermore, a source/drain via is disposed over the source/drain contact. A bottom end of the source/drain via is positioned lower than a top end of the dielectric layer.

Full Text

What is claimed is:

A semiconductor device includes a semiconductor structure extending lengthwise along a first direction, with a first source/drain feature and a second source/drain feature disposed on the semiconductor structure and spaced apart from each other. A gate structure extends lengthwise along a second direction across the semiconductor structure and is positioned between the first source/drain feature and the second source/drain feature. A source/drain contact is disposed over the first source/drain feature. A dielectric layer extends along a sidewall of the source/drain contact and protrudes over a top surface of the source/drain contact. Furthermore, a source/drain via is disposed over the source/drain contact. A bottom end of the source/drain via is positioned lower than a top end of the dielectric layer.
Timeline
Filed
06/02/2026
Published
09/24/2026
Granted
Not Available
IPC Codes(3)
H10D 30/62:Fin field-effect transistors [FinFET]
H10D 30/01:Manufacture or treatment
H10D 64/01:Manufacture or treatment