An electronic device manufacturing system configured to obtain sensor data associated with a deposition process performed to deposit a film stack on a substrate. The sensor data comprises a first set of sensor values associated with a first region of the substrate and a second set of sensor values associated with a second region. The first set of sensor values is processed using a first mapping model to generate a first output and the second set of sensor values is processed using a second mapping model to generate a second output. The first mapping model is specific to the first region and the second mapping model is specific to the second region. The first output and the second output are inputted into a machine-learning model. A third output is outputted reflecting a physical property of the film stack. A parameter of a manufacturing system is adjusted using the third output.