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/Vertical Tethers For Micro-transfer Printing
Abstract

A micro-transfer-printable component source structure includes a source wafer comprising an anchor portion, a sacrificial portion disposed on only a portion of the source wafer adjacent to the anchor portion, a component disposed directly and exclusively over the sacrificial portion, and a vertical tether physically connecting the component to the source wafer. The vertical tether extends from the component along a side of the sacrificial portion to the anchor portion and includes a vertical portion that extends in a direction at least partially orthogonal to a surface of the source wafer. The vertical portion can be between the component and the source wafer or adjacent to the component. Components with vertical tethers require less area on the source wafer and can be micro-transfer printed to a target substrate in closer alignment.

Full Text

What is claimed is:

A micro-transfer-printable component source structure includes a source wafer comprising an anchor portion, a sacrificial portion disposed on only a portion of the source wafer adjacent to the anchor portion, a component disposed directly and exclusively over the sacrificial portion, and a vertical tether physically connecting the component to the source wafer. The vertical tether extends from the component along a side of the sacrificial portion to the anchor portion and includes a vertical portion that extends in a direction at least partially orthogonal to a surface of the source wafer. The vertical portion can be between the component and the source wafer or adjacent to the component. Components with vertical tethers require less area on the source wafer and can be micro-transfer printed to a target substrate in closer alignment.
Timeline
Filed
06/02/2026
Published
09/24/2026
Granted
Not Available
IPC Codes(4)
H10H 20/01:Manufacture or treatment
H10F 71/00:Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F 19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F 19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F 39/00)
H10F 77/30:Coatings (arrangements for preventing damage to photovoltaic cells caused by corpuscular radiation H10F 77/80)