A stacked electronic device is disclosed. The stacked electronic device can comprise a die stack including two or more connected dies, such as a lower die, an upper die, and a middle die between the lower die and the upper die. A plurality of through substrate vias (TSVs) can provide signal transmission to dies of the stack. A power supply path can be configured to provide power to the middle die without passing through the lower die. In some embodiments, external paths can provide power through an upper surface of a die in the stack while signals are supplied through the lower surface.