/Catalyst Application Bath For Electroless Plating, Method Of Producing Catalytic Nucleus-containing Material To Be Electroless Plated, Method Of Producing Material With Electroless Plating Deposit, And Material With Electroless Plating Deposit
Abstract

Provided are a catalyst application bath for electroless plating, a method of producing a catalytic nucleus-containing material to be electroless plated using the catalyst application bath for electroless plating, a method of producing a material with an electroless plating deposit, and a material with an electroless plating deposit, each of which may provide good patternability even without a post-dip step which can cause non-deposition in electroless plating, and thus may achieve both patternability and electroless plating deposition. Included is a catalyst application bath for electroless plating, containing a palladium compound and an aminocarboxylic acid.

Full Text

What is claimed is:

Provided are a catalyst application bath for electroless plating, a method of producing a catalytic nucleus-containing material to be electroless plated using the catalyst application bath for electroless plating, a method of producing a material with an electroless plating deposit, and a material with an electroless plating deposit, each of which may provide good patternability even without a post-dip step which can cause non-deposition in electroless plating, and thus may achieve both patternability and electroless plating deposition. Included is a catalyst application bath for electroless plating, containing a palladium compound and an aminocarboxylic acid.
Timeline
Filed
06/02/2026
Published
09/24/2026
Granted
Not Available
IPC Codes(1)
C23C 18/54:Contact plating, i.e. electroless electrochemical plating