Example embodiments relate to electronic packages and devices that include electronic packages. One example electronic package includes a printed circuit board having a first surface and a second surface. The electronic package also includes a semiconductor die including electronic circuitry integrated thereon. The semiconductor die is mounted on the die pad and has a plurality of terminals for inputting and outputting electrical signals. Additionally, the electronic package includes a body of a solidified molding compound covering the first surface of the printed circuit board and encapsulating the semiconductor die at a first side of the body. The body has a second side opposite to the first side. Further, the electronic package includes a plurality of package terminals arranged on the second side of the body of solidified molding compound. Each package terminal is electrically connected using a conductive structure.