An imprint apparatus that forms a pattern on a substrate using a mold and an imprint material comprises a plurality of measurement units configured to measure a misalignment amount between the mold and the substrate by detecting a plurality of internal measurement marks disposed on the mold and the substrate, an alignment unit configured to perform alignment of the mold and the substrate based on the misalignment amount measured by the plurality of measurement units, and a correction unit configured to respectively acquire a measurement error of each of the plurality of measurement units based on a deviation amount between external measurement marks provided on the mold and the substrate, and correct the alignment by the alignment unit based on the measurement error of each of the plurality of measurement units.