A manufacturing method for a metal frame chip embedded packaging substrate includes preparing a metal plate, forming a metal frame surrounding a cavity by penetrating the metal plate, and selectively partially etching a first surface of the metal frame to form a first groove on the metal frame, embedding a chip in the cavity so that a patterned side of the chip faces the first surface, and laminating a dielectric layer on a second surface of the metal frame opposite the first surface, the dielectric layer covering a back side of the chip and filling the first groove, forming a blind hole and a window on the dielectric layer, and forming a first wiring layer on the first surface and a second wiring layer on the second surface, the first wiring layer being connected to a terminal of the chip.