Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.
Full Text
What is claimed is:
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a first layer that comprises glass. In an embodiment, a second layer comprising glass is over the first layer. In an embodiment, the electronic package further comprises an inductor between the first layer and the second layer.
Timeline
Filed
06/12/2026Published
10/01/2026Granted
Not AvailableIPC Codes(10)
H10W 44/00:Electrical arrangements for controlling or matching impedance
H01F 17/00:Fixed inductances of the signal type
H01F 27/28:Coils; Windings; Conductive connections